Mini adopts new self-developed 12μm VOx infrared detector and a custom ASIC infrared image processing chip. It features a compact size, lighter weight, and lower power consumption. The 256/384/640 series of infrared modules achieve a size of 21mm×21mm, meeting the application requirements of SWaP3 (Size, Weight and Power, Performance, Price). It is highly suitable for various devices such as small handheld imagers, outdoor sights, wearable devices, lightweight drones, robots, for many applications such as security and industrial temperature measurement.
Pixel size: 12μm
Dimension: entire series 21mm×21mm, ＜8g
(1) Autonomous core, cost-effective:
The self-developed 12μm WLP infrared detectors in the 256/384/640 series offer excellent value for cost and are the optimal choice for the same resolution.
The self-developed high-performance LY ASIC infrared image processing chip has completely independent core technology and supply.
(2) Outstanding performance, lightweight and convenient:
Provide smooth and high-definition images, supporting up to 50Hz lossless image quality.
Two precise temperature measurement modes cover a wide temperature range and ensure temperature stability in different ambient temperatures.
The entire series has ultra-compact size of 21mm×21mm, with a module body weighing less than 8g, making integration easy.
(3) Rich functions, multiple options:
Lensless solutions, manual/auto-focus non-thermalized lenses cover various scenarios.
Abundant Windows/Linux/Android SDK interfaces provide diverse functionality.
|Main Specifications||MINI 640||MINI 384||MINI 256|
|Detector Type||VOx infrared detector|
|Detector Frame Rate||Imaging module: 50Hz；||25Hz|
|Temperature measurement module: 25Hz；|
|NETD||≤50mK@25℃, F#1.0（≤40mK optional）|
|Brightness Adjustment||0~255, optional|
|Contrast Adjustment||0~255, optional|
|Digital Zoom||0.25×~2.0× continuous zoom|
|Image Processing||TEC-less algorithm||-|
|Digital filter noise reduction|
|Digital detail enhancement|
|Module Power Supply|
|Service Voltage||3.3V, 5V dual power supply|
|Typical Power Consumption @ 25ºC||＜0.55W||＜0.50W||＜0.30W|
|Module Output and Communication Interface|
|Expansion Board and Optional Interfaces|
|Power Protection||Support overvoltage, undervoltage, and reverse connection protection|
|Output and Control Interfaces||USB2.0+I²C image output, providing Linux/Windows/Android SDK|
|Physical Characteristics of Module|
|Lens||Without lens/fixed focus/manual focusing|
|Temperature Measurement Functions||Target temperature -20°C～+150°C: Accuracy ±2°C or ±2% of reading (whichever is greater, @-20°C~60°C ambient temperature)|
|Target temperature 50°C～+550°C: Accuracy ±5°C or ±3% of reading (whichever is greater, @-20°C~60°C ambient temperature)|
|Temperature Measurement Methods||Point, line, frame|
|Vibration||6.06g, random vibration, all axes|
|Impact||80g, 4ms, final peak sawtooth wave, three axes, and six directions|