"G1 Series Uncooled Infrared Thermal Imaging Module employs InfiSense self-developed ASIC infrared image processing chip to replace the FPGA chip of traditional thermal imaging modules. With full-series 12μm VOx ceramic packaged detector to provide high-quality infrared images and high-accuracy temperature measurement functions, it features a combination of high performance, compactness, lightweight, low power consumption, and low cost, meeting the application requirements of SWAP3 (Size, Weight and Power, Performance, Price).
Pixel size: 12μm
Detector package: Ceramic package
Compactness, low power consumption, and lightweight
b) a) The size is greatly reduced benefiting from the compactness and high integration of ASIC;
b) The power consumption is extremely low benefiting from the low power consumption of ASIC;
c) The weight is greatly reduced benefiting from the only circuit board of ASIC.
a) The core processor adopts InfiSense self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption compared with traditional FPGA, with a competitive price;
b) Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement function.
Rich and Flexible Interfaces, Easy to Integrate
a) The module supports DVP parallel digital video output, SPI video transmission, and I2C and UART communication interface;
b) The module supports digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS;
c) The module supports simultaneous output of image data + temperature data;
d) The module integrates MCU internally and provides secondary development SDK.
Ceramic packaged uncooled VOx infrared focal plane detector
Detector Frame Rate
≤50Hz@25°C, F#1.0 (≤40mK, optional)
TEC Temperature Control
0.25×~2.0× continuous zoom
Digital filtering and noise reduction
Digital detail enhancement
Module Power Supply
1.8V, 3.3V, 5V
Typical Power Consumption @ 25ºC
Physical Characteristics of Module (without lens)
Module Interface (module+expansion board)
Support overvoltage, undervoltage, and reverse connection protection
Video Output Interface
BT.1120, LVCMOS, HDMI, USB3.0
Athermalized Prime Lens
Electric Focusing Lens
6.06g, random vibration, all axes
80g, 4ms, final peak sawtooth wave, three axes, and six directions