"G1 Series Uncooled Infrared Thermal Imaging Module employs InfiSense self-developed ASIC infrared image processing chip to replace the FPGA chip of traditional thermal imaging modules. With full-series 12μm VOx ceramic packaged detector to provide high-quality infrared images and high-accuracy temperature measurement functions, it features a combination of high performance, compactness, lightweight, low power consumption, and low cost, meeting the application requirements of SWAP3 (Size, Weight and Power, Performance, Price).
Resolution: 1024×768/1280×1024
Pixel size: 12μm
Detector package: Ceramic package
Compactness, low power consumption, and lightweight
b) a) The size is greatly reduced benefiting from the compactness and high integration of ASIC;
b) The power consumption is extremely low benefiting from the low power consumption of ASIC;
c) The weight is greatly reduced benefiting from the only circuit board of ASIC.
Self-developed Core
a) The core processor adopts InfiSense self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption compared with traditional FPGA, with a competitive price;
b) Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement function.
Rich and Flexible Interfaces, Easy to Integrate
a) The module supports DVP parallel digital video output, SPI video transmission, and I2C and UART communication interface;
b) The module supports digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS;
c) The module supports simultaneous output of image data + temperature data;
d) The module integrates MCU internally and provides secondary development SDK.
Component Model | G1 1024 | G1 1280 |
Detector | Ceramic packaged uncooled VOx infrared focal plane detector | |
Pixel Size | 12μm | |
Spectral Band | 8~14μm | |
Resolution | 1024×768 | 1280×1024 |
Detector Frame Rate | 30Hz | |
NETD | ≤50Hz@25°C, F#1.0 (≤40mK, optional) | |
TEC Temperature Control | Supported | |
Image Adjustment | ||
Brightness Adjustment | 0~255, optional | |
Contrast Adjustment | 0~255, optional | |
Polarity | Black-hot/White-hot | |
Palettes | Supported | |
Reticle | Display/Blank/Move | |
Digital Zoom | 0.25×~2.0× continuous zoom | |
Mirroring | Horizontal/Vertical/Diagonal | |
Image Processing | TEC-less algorithm | |
Non-uniformity correction | ||
Digital filtering and noise reduction | ||
Digital detail enhancement | ||
Module Power Supply | ||
Service Voltage | 1.8V, 3.3V, 5V | |
Typical Power Consumption @ 25ºC | <0.95W | <1W |
Module Interface | ||
Digital Video | DVP | |
Communication Interface | I2C/UART | |
Physical Characteristics of Module (without lens) | ||
Weight | <75g | |
Dimensions | 42mm×42mm×26mm | |
Module Interface (module+expansion board) | ||
Service Voltage | 5~12V | |
Power Protection | Support overvoltage, undervoltage, and reverse connection protection | |
Video Output Interface | BT.1120, LVCMOS, HDMI, USB3.0 | |
Communication Interface | I2C/RS232/UART | |
Button | Four buttons | |
Adaptive Lens | ||
Athermalized Prime Lens | F1.0:35mm/55mm/75mm/100mm | |
Electric Focusing Lens | Supported | |
Environment Adaptability | ||
Operating Temperature | -40°C~+80°C | |
Storage Temperature | -45°C ~85°C | |
Humidity | 5%~95%, non-condensing | |
Vibration | 6.06g, random vibration, all axes | |
Impact | 80g, 4ms, final peak sawtooth wave, three axes, and six directions |
12/01/2022
11/22/2022