G1 1024/1280 Thermal Module

"G1 Series Uncooled Infrared Thermal Imaging Module employs InfiSense self-developed ASIC infrared image processing chip to replace the FPGA chip of traditional thermal imaging modules. With full-series 12μm VOx ceramic packaged detector to provide high-quality infrared images and high-accuracy temperature measurement functions, it features a combination of high performance, compactness, lightweight, low power consumption, and low cost, meeting the application requirements of SWAP3 (Size, Weight and Power, Performance, Price).

Resolution: 1024×768/1280×1024

Pixel size: 12μm

Detector package: Ceramic package

Features
Applications
Specifications

Features

Features
Applications
Specifications

Features of G1 1024/1280 Thermal Module

Compactness, low power consumption, and lightweight

b) a) The size is greatly reduced benefiting from the compactness and high integration of ASIC;

b) The power consumption is extremely low benefiting from the low power consumption of ASIC;

c) The weight is greatly reduced benefiting from the only circuit board of ASIC.

Self-developed Core

a) The core processor adopts InfiSense self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption compared with traditional FPGA, with a competitive price;

b) Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement function.

Rich and Flexible Interfaces, Easy to Integrate

a) The module supports DVP parallel digital video output, SPI video transmission, and I2C and UART communication interface;

b) The module supports digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS;

c) The module supports simultaneous output of image data + temperature data;

d) The module integrates MCU internally and provides secondary development SDK.

Applications of G1 1024/1280 Thermal Module

G1 1024/1280 Thermal Module Applications

Open Source

InfiRay

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Specifications of G1 1024/1280 Thermal Module

Component Model	G1 1024	G1 1280
Detector	Ceramic packaged uncooled VOx infrared focal plane detector
Pixel Size	12μm
Spectral Band	8~14μm
Resolution	1024×768	1280×1024
Detector Frame Rate	30Hz
NETD	≤50Hz@25°C, F#1.0 (≤40mK, optional)
TEC Temperature Control	Supported
Image Adjustment
Brightness Adjustment	0~255, optional
Contrast Adjustment	0~255, optional
Polarity	Black-hot/White-hot
Palettes	Supported
Reticle	Display/Blank/Move
Digital Zoom	0.25×~2.0× continuous zoom
Mirroring	Horizontal/Vertical/Diagonal
Image Processing	TEC-less algorithm
	Non-uniformity correction
	Digital filtering and noise reduction
	Digital detail enhancement
Module Power Supply
Service Voltage	1.8V, 3.3V, 5V
Typical Power Consumption @ 25ºC	<0.95W	<1W
Module Interface
Digital Video	DVP
Communication Interface	I2C/UART
Physical Characteristics of Module (without lens)
Weight	<75g
Dimensions	42mm×42mm×26mm
Module Interface (module+expansion board)
Service Voltage	5~12V
Power Protection	Support overvoltage, undervoltage, and reverse connection protection
Video Output Interface	BT.1120, LVCMOS, HDMI, USB3.0
Communication Interface	I2C/RS232/UART
Button	Four buttons
Adaptive Lens
Athermalized Prime Lens	F1.0:35mm/55mm/75mm/100mm
Electric Focusing Lens	Supported
Environment Adaptability
Operating Temperature	-40°C~+80°C
Storage Temperature	-45°C ~85°C
Humidity	5%~95%, non-condensing
Vibration	6.06g, random vibration, all axes
Impact	80g, 4ms, final peak sawtooth wave, three axes, and six directions

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