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G1 1024/1280 Thermal Module

  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module

"G1 Series Uncooled Infrared Thermal Imaging Module employs InfiSense self-developed ASIC infrared image processing chip to replace the FPGA chip of traditional thermal imaging modules. With full-series 12μm VOx ceramic packaged detector to provide high-quality infrared images and high-accuracy temperature measurement functions, it features a combination of high performance, compactness, lightweight, low power consumption, and low cost, meeting the application requirements of SWAP3 (Size, Weight and Power, Performance, Price).


Resolution: 1024×768/1280×1024

Pixel size: 12μm

Detector package: Ceramic package

  • Features
  • Applications
  • Specifications
Features
  • Features
  • Applications
  • Specifications

Features of G1 1024/1280 Thermal Module

Compactness, low power consumption, and lightweight

b) a) The size is greatly reduced benefiting from the compactness and high integration of ASIC;

b) The power consumption is extremely low benefiting from the low power consumption of ASIC;

c) The weight is greatly reduced benefiting from the only circuit board of ASIC.


Self-developed Core

a) The core processor adopts InfiSense self-developed ASIC infrared processing chip, which is only 1/6 of the size and 1/3 of the power consumption compared with traditional FPGA, with a competitive price;

b) Equipped with industry-leading thermal image processing algorithm and temperature measurement algorithm, it can provide high-quality image and high-accuracy temperature measurement function.


Rich and Flexible Interfaces, Easy to Integrate

a) The module supports DVP parallel digital video output, SPI video transmission, and I2C and UART communication interface;

b) The module supports digital video formats such as RAW14, YUV, Y8, BT.656, BT.1120, and LVCMOS;

c) The module supports simultaneous output of image data + temperature data;

d) The module integrates MCU internally and provides secondary development SDK.

Applications of G1 1024/1280 Thermal Module


G1 1024/1280 Thermal Module Applications

Infrared Open Source Platform
Infrared Open Source Platform

Specifications of G1 1024/1280 Thermal Module


Component Model

G1 1024

G1 1280

Detector

Ceramic packaged uncooled VOx infrared focal plane detector

Pixel Size

12μm


Spectral Band

8~14μm


Resolution

1024×768

1280×1024

Detector Frame Rate

30Hz


NETD

≤50Hz@25°C, F#1.0 (≤40mK, optional)

TEC Temperature Control

Supported

Image Adjustment

Brightness Adjustment

0~255, optional

Contrast Adjustment

0~255, optional

Polarity

Black-hot/White-hot

Palettes

Supported

Reticle

Display/Blank/Move

Digital Zoom

0.25×~2.0× continuous zoom

Mirroring

Horizontal/Vertical/Diagonal

Image Processing

TEC-less algorithm


Non-uniformity correction


Digital filtering and noise reduction


Digital detail enhancement

Module Power Supply

Service Voltage

1.8V, 3.3V, 5V

Typical Power Consumption @ 25ºC

<0.95W

<1W

Module Interface

Digital Video

DVP

Communication Interface

I2C/UART

Physical Characteristics of Module (without lens)

Weight

<75g

Dimensions

42mm×42mm×26mm

Module Interface (module+expansion board)

Service Voltage

5~12V

Power Protection

Support overvoltage, undervoltage, and reverse connection protection

Video Output Interface

BT.1120, LVCMOS, HDMI, USB3.0

Communication Interface

I2C/RS232/UART

Button

Four buttons

Adaptive Lens

Athermalized Prime Lens

F1.0:35mm/55mm/75mm/100mm

Electric Focusing Lens

Supported

Environment Adaptability

Operating Temperature

-40°C~+80°C

Storage Temperature

-45°C ~85°C

Humidity

5%~95%, non-condensing

Vibration

6.06g, random vibration, all axes

Impact

80g, 4ms, final peak sawtooth wave, three axes, and six directions


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