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G1 1280 ASIC Thermal Module

  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module
  • G1 1024/1280 Thermal Module

G1 adopts the LY infrared processing chip independently developed by InfiSense, equipped with a new self-developed 12µm 1280×1024 high-resolution VOx ceramic infrared detector. It  can be flexibly connected to various intelligent processing platforms and can provide industry-leading ultra-high resolution to meet a variety of high-end imaging observation applications. Its high performance, small size, light weight, low power consumption, low cost meet the application requirements of SWaP (Size, Weight, and Power/Price).


Resolutin: 1280×1024

Pixel size: 12μm

Dimension: 42mm×42mm×26mm


  • Features
  • Applications
  • Specifications
Features
  • Features
  • Applications
  • Specifications

Features of G1 1280 ASIC Thermal Module

(1) Independent core, worry-free supply:

Using self-developed high-performance 1280 resolution ceramic package uncooled detector, stable supply and high reliability;

Self-developed high-performance LY ASIC infrared image processing chip, the core technology and supply are completely independent.

(2) Ultra-clear image, sensory impact:

Compared with other products with the same resolution, it is small in size, light in weight, and easy to integrate and develop;

High-sensitivity infrared detector and ASIC professional image processing, pursuit of high-end image quality, ultra-long-range locking target;

(3) Rich in functions, adaptable to various scenarios:

Can provide no lens solution or multiple lens adaptation, support interface board customization;

The SDK is rich in functions and can adjust multiple image parameters;

It is suitable for many fields such as security monitoring, drones, handheld sights, AR glasses, AI recognition, etc.

Applications of G1 1280 ASIC Thermal Module


Applications.jpg

Infrared Open Source Platform
Infrared Open Source Platform

Specifications of G1 1280 ASIC Thermal Module


Component Model

G1 1280

Resolution

1280×1024

Detector Frame Rate

30Hz

Pixel Size

12μm

Detector

VOx infrared detector

Pixel Size

12μm

Spectral Band

8~14μm

NETD

≤50Hz@25°C, F#1.0 (≤40mK, optional)
Image Adjustment

Brightness Adjustment

0~255, optional

Contrast Adjustment

0~255, optional

Polarity

Black-hot/White-hot

Palettes

Supported

Mirroring

Horizontal/Vertical/Diagonal

Reticle

Display/Blank/Move

Image Processing

Image stretching

Non-uniformity correction

Digital filtering and noise reduction

Digital detail enhancement

Module Power Supply

Supply Voltage

5V

Typical Power Consumption @ 25ºC

<1W

Module Interface

Digital Video

DVP (USB for demonstration)

Communication Interface

I2C

Environment Adaptability

Operating Temperature

-30°C~+65°C

Storage Temperature

-50°C ~+85°C

Humidity

5%~95%, non-condensing

Vibration

6.06g, random vibration, all axes

Impact

80g, 4ms, final peak sawtooth wave, three axes, and six directions


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