G1 adopts the LY infrared processing chip independently developed by InfiSense, equipped with a new self-developed 12µm 1280×1024 high-resolution VOx ceramic infrared detector. It can be flexibly connected to various intelligent processing platforms and can provide industry-leading ultra-high resolution to meet a variety of high-end imaging observation applications. Its high performance, small size, light weight, low power consumption, low cost meet the application requirements of SWaP (Size, Weight, and Power/Price).
Resolutin: 1280×1024
Pixel size: 12μm
Dimension: 42mm×42mm×26mm
(1) Independent core, worry-free supply:
Using self-developed high-performance 1280 resolution ceramic package uncooled detector, stable supply and high reliability;
Self-developed high-performance LY ASIC infrared image processing chip, the core technology and supply are completely independent.
(2) Ultra-clear image, sensory impact:
Compared with other products with the same resolution, it is small in size, light in weight, and easy to integrate and develop;
High-sensitivity infrared detector and ASIC professional image processing, pursuit of high-end image quality, ultra-long-range locking target;
(3) Rich in functions, adaptable to various scenarios:
Can provide no lens solution or multiple lens adaptation, support interface board customization;
The SDK is rich in functions and can adjust multiple image parameters;
It is suitable for many fields such as security monitoring, drones, handheld sights, AR glasses, AI recognition, etc.
Component Model | G1 1280 |
Resolution | 1280×1024 |
Detector Frame Rate | 30Hz |
Pixel Size | 12μm |
Detector | VOx infrared detector |
Pixel Size | 12μm |
Spectral Band | 8~14μm |
NETD | ≤50Hz@25°C, F#1.0 (≤40mK, optional) |
Image Adjustment | |
Brightness Adjustment | 0~255, optional |
Contrast Adjustment | 0~255, optional |
Polarity | Black-hot/White-hot |
Palettes | Supported |
Mirroring | Horizontal/Vertical/Diagonal |
Reticle | Display/Blank/Move |
Image Processing | Image stretching |
Non-uniformity correction | |
Digital filtering and noise reduction | |
Digital detail enhancement | |
Module Power Supply | |
Supply Voltage | 5V |
Typical Power Consumption @ 25ºC | <1W |
Module Interface | |
Digital Video | DVP (USB for demonstration) |
Communication Interface | I2C |
Environment Adaptability | |
Operating Temperature | -30°C~+65°C |
Storage Temperature | -50°C ~+85°C |
Humidity | 5%~95%, non-condensing |
Vibration | 6.06g, random vibration, all axes |
Impact | 80g, 4ms, final peak sawtooth wave, three axes, and six directions |
09/24/2023
09/22/2023