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RTD6171MR Metal Packaging Infrared Security Sensor

  • RTD6171MR Metal Packaging Infrared Security Sensor
  • RTD6171MR Metal Packaging Infrared Security Sensor
  • RTD6171MR Metal Packaging Infrared Security Sensor

RTD6171MR Metallic Packaged Uncooled Infrared Detector employs a self-developed 17μm uncooled VOx thermal imaging sensor capable of 640×512 resolution. It features a combination of high sensitivity and reliability to meet stringent image quality requirements.

Resolution: 640×512

Pixel size: 17μm


  • Features
  • Videos
  • Applications
  • Specifications
Features
  • Features
  • Applications
  • Specifications

Features of RTD6171MR Metal Packaging Infrared Security Sensor

1. VOx microbolometer

2. Superior environment adaptability

3. High sensitivity: NETD<60mK

4. Thermal time constant:<10ms

5. Low fixed pattern noise (FPN)

Video of RTD6171MR Metal Packaging Infrared Security Sensor

Applications of RTD6171MR Metal Packaging Infrared Security Sensor

RTD6171MR Metal Packaging Infrared Security Sensor Applications

Infrared Open Source Platform
Infrared Open Source Platform

Specifications of RTD6171MR Metal Packaging Infrared Security Sensor


Array Format

Item

Specifications

Model

RTD6171MR

Sensor Technology

Uncooled VOx microbolometer

Spectral Band

LWIR, 8-14μm

Pixel Pitch

17μm

Array Format

640 × 512

Operability

≥99.5%

NETD

≤60mK (@f/1.0,50Hz,300K)

Thermal Time Constant

10ms

Operating Frame Rate

50Hz

Power Consumption

<250mW (25°C, excluding TEC)

Output Signal

Analog output

Operating Temperature Range

-40°C~+60°C

Package Type

Metallic vacuum package

Size

23.5×32×7.7mm³ (without pin)

Weight

<25g

Dynamic Analog Output Range

1.0~3.4V

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