Replacing FPGA —Infisense Released a Full Series of InfiRay® Thermal Imaging Modules Based on Self-developed ASIC Image Processing Chip

As a leading manufacturer of uncooled IRFPA, InfiRay is the first to achieve mass production of the full series of high-performance 12 μm infrared imaging chips in the industry, and has made a great breakthrough in the field of ASIC image processing chips.

InfiRay® became the first one to release a full series of infrared thermal imaging modules based on self-developed ASIC image processing chips.

Infisense self-developed LY processing chip in this range of modules has replaced the FPGA solution provided by the traditional thermal imaging modules. Featuring smaller size, lighter weight, and lower power consumption and costs, as well as higher performance, it can meet the application requirements for Size, Weight, Power, Price, and Performance (SWaP3) of the new generation of infrared detectors.

LY Processing Chip

This is the first dedicated infrared image processing chip of Infisense, which fully supports infrared temperature measurement and real-time detection of points, lines, and area, digital zoom, various pseudo colors, OSD, and other functions.

With powerful and professional infrared image processing capabilities, the LY ASIC image processing chip supports non-uniformity correction (NUC), TEC-less, digital filtering noise reduction, and digital detail enhancement (DDE).

Comparison of parameters of LY ASIC and international mainstream FPGAs:

LY Processing Chip

International Mainstream FPGA

Power consumption




8 mm × 8 mm

19 mm × 19 mm


< USD 3

> USD 31

From 256 to 1280,

G and Mini Series Full Coverage

InfiRay® released G and Mini series infrared thermal imaging modules equipped with LY ASIC processing chips. Both of them use self-developed 12 μm high-performance VOx uncooled IRFPA detectors to provide DVP and I2C outputs, featuring low power consumption, small size, light weight, low cost, and high performance, thus meeting the professional needs of various industries.

G Series Modules

For perimeter monitoring and other high-end application scenarios, the G1 1280/1024 is equipped with a 12 μm detector with ultra-large area arrays, a small body only equal to the size of a matchbox (42 mm × 42 mm × 26 mm), and power consumption as low as 1 W. It provides expansion boards and supports interfaces of LAN, USB 3.0, LVDS, HDMI, Cameralink, BT.1120, and PAL.

For security surveillance, industrial temperature measurement, and other application scenarios, the G1 640/384 is equipped with a 12 μm 640/384 detector with a small body only equal to the size of an American dollar (26 mm × 26 mm × 19 mm), ultra-low power consumption of 0.45 W (640)/0.40 W (384), temperature measurement range of –20°C~+150°C or 0°C~550°C, and temperature measurement accuracy of ±2°C or ±2%. It provides expansion boards and supports interfaces of BT.656, USB, LAN, Cameralink, and PAL.

Mini Series Modules

For application scenarios with extremely high requirements for size and weight, such as UAV loads and other portable terminals, the Mini 640/384/256 has a small body only equal to the size of an American quarter (21 mm × 21 mm), an ultra-low power consumption of 0.45 W (640)/0.40 W (384)/0.30 W (256), and a weight less than 10 g (without lens and flanges). It provides expansion boards and supports USB 2.0, BT.656, and PAL interfaces.

Currently, Infisense has started to send samples of its infrared thermal imaging modules based on self-developed ASIC processors. For sample application or other technical information, please contact marketing and sales personnel of Infisense by sending an email to

Parameter Appendix

About Infisens

InfiSense Technology Co., Ltd.

InfiSense Technology Co., Ltd. is dedicated to providing sensors and solutions for applications with strict demand for integration, low power consumption, and low cost. The main products are low-cost infrared thermal imaging sensors, ASIC processing chips, and other related solutions.

InfiSense’s products are widely applied in fields such as epidemic prevention and control, industrial temperature measurement, outdoor observation, automatic driving, IoT, AI, and machine vision.

InfiSense, infinite sensing, intelligent living.