As the most mature and stable performance packaging method for uncooled infrared detectors nowadays, metallic packaging is still the mainstream of high-performance applications. It is excellent in sensitivity, imaging quality and reliability, and can also adapt to a variety of extremely harsh environments. There is an InfiRay self-developed VOx thermal imaging sensor (10μm, 12μm or 17μm) with high resolution (1280×1024, 1024×768, 640×512 or 384×288) inside Metallic Packaged Uncooled Infrared Detector. It's not only highly sensitive but also reliable to offer Ultra Clear thermal images.
VOx Microbolometer Technology is applied in Metallic Packaged Uncooled Infrared Detector.
Metallic Packaged Uncooled Infrared Detector is able to adapt to various extremely harsh environments.
Metallic Packaged Uncooled Infrared Detector is not only highly sensitive but also reliable to offer Ultra Clear thermal images.
It takes less than 10ms for Metallic Packaged Uncooled Infrared Detector to generate a complete and accurate thermal image. The smaller the thermal time constant, the faster the image is generated and faster moving objects can be captured.
Metallic Packaged Uncooled Infrared Detector has the characteristics of Low Fixed Pattern Noise so the output thermal image is vivid and crispy.
Metal packaging is the most primitive form of thermal detector packaging. It has the characteristics of high mechanical strength, excellent heat dissipation performance, and good airtightness, which is not affected by external environmental factors. The disadvantage is that it is expensive. Also, the shape flexibility is too small to meet the needs of the increasingly rapid development of thermal imaging devices. The ceramic packaging process is similar to metal packaging, which is also a mature infrared detector packaging technology. Compared with metal packaging, the volume and weight of the packaged detector will be greatly reduced. The cost of raw materials and manufacturing is lower than that of traditional metal packaging, which is suitable for the mass production of electronic components. However, it still meet the application needs of emerging fields such as smart homes and consumer electronics.