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LGC6122 pro Infrared Thermal Imaging Module

  • LGC6122 pro Infrared Thermal Imaging Module
  • LGC6122 pro Infrared Thermal Imaging Module
  • LGC6122 pro Infrared Thermal Imaging Module
  • LGC6122 pro Infrared Thermal Imaging Module

The module is excellent in low power consumption, thermal control and high reliability design. 


With the built-in nonperceptual correction algorithm, it does not need shutter correction in the use process, which has a significant advantage in the applications with high video coherence requirements. It can meet the product requirements of infrared thermal imaging design devices, such as vehicle-mounted, airborne, ship-mounted and handheld, which have higher requirements for video continuity and reliability, and higher reliability specifications can be customized. 


It supports multiple communication protocols and video output formats and provides infrared lenses with varied specifications for diversified applications. 


Resolution: 640×512 

Pixel size: 12μm

  • Features
  • Applications
  • Specifications
Features
  • Features
  • Applications
  • Specifications

Features of LGC6122 pro Infrared Thermal Imaging Module

Nonperceptual correction algorithm 

  • The use process of module requires no shutter correction, so that the whole process is silent, the image is not stuck, and the image is more hidden and safer. Fifth-generation infrared processing algorithm, image upgrade;

  • Infrared noise reduction algorithm upgrade, fine image and quiet without noise;

  • Infrared stretch algorithm upgrade to optimize extreme scene imaging.


Compactness, lightweight, and low power consumption 

  • Compactness. Its dimension is 29.5mm×29.5mm×28mm (without lens and the extension component);

  • Lightweight. Its weight is 35g±3g (without lens and the extension component);

  • Low power consumption. Its lowest power consumption is 900mW (without user extension component).


Support several types of serial communication and video output interfaces  

  • 2 UART serial communication interfaces; 

  • Analog video output and PAL/NTSC system;

  • LVCMOS/LVDS/BT656 digital video output.


Secure and reliable 

  • The module component is self-developed, reliable and technically secure; 

  • Resolution of 640×512, fast and efficient; 

  • Good vibration and impact resistance.

Applications of LGC6122 pro Infrared Thermal Imaging Module


LGC6122 Pro For Infrared Image

Infrared Open Source Platform
Infrared Open Source Platform

Specifications of LGC6122 pro Infrared Thermal Imaging Module


Product Model

LGC6122 pro

Performance Indicator

Detector Type

Uncooled VOx infrared focal plane detector

Array Size

640×512

Pixel Size

12μm

Spectral Band

8~14μm

MRTD

≤250mK

NETD

<20mK

Frame Rate

25/50Hz

Image Adjustment

Polarity

White-hot/Black-hot

Palette

Support

Digital Zoom

1.0~4.0×continuous zoom (step size: 0.1)

Mirroring

Vertical/Horizontal/Diagonal

Reticle

Display/Blank/Move

Character Superimposition

Support

Image Processing

Nonperceptual correction

Digital filtering noise reduction

Digital detail enhancement

Power Supply

Power Supply Range

6~18VDC

Typical power consumption @ 25°C (without user extension component)

800mW

Power Protection

Overvoltage, undervoltage, and reverse connection protection supported by user extension component

Interface

Analog Video

1-channel PAL or 1-channel NTSC

Digital Video

LVDS/LVCMOS/BT.656

Support customized user interface board

Serial Communication Interface

UART,RS232,RS422

Button

Four buttons

Optical Lens

Focusing Mode

Athermalized

Horizontal FOV/Focal length

89°/4.1mm

70°/5.8mm

48°/9.1mm

33°/13mm

22°/19mm

17°/25mm

12.5°/35mm

8°/55mm

5.9°/75mm

4.4°/100mm

Continuous zooming

Horizontal FOV/Focal length

5.9°~17.6°/25~75mm

4.4°~22°/20~100mm

2.9°~14.7°/30~150mm

Mechanical Parameters

Dimensions (without lens and extension component)

29.5×29.5×29.5mm

Weight (without lens and extension component)

35g±3g

Environmental Parameters

Operating Temperature Range

-40°C~+85°C

Storage Temperature Range

-50℃~+90℃

Vibration Resistance

10.2g, random vibration, all axes

Impact Resistance

Half-sine wave 80g 6ms, five times in three axes and six directions, respectively


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